{"id":22,"date":"2019-11-22T11:26:00","date_gmt":"2019-11-22T10:26:00","guid":{"rendered":"https:\/\/enablingmnt.com\/?page_id=22"},"modified":"2019-11-22T11:26:00","modified_gmt":"2019-11-22T10:26:00","slug":"home","status":"publish","type":"page","link":"https:\/\/enablingmnt.com\/","title":{"rendered":"Home"},"content":{"rendered":"<div id=\"dslc-main\">\r\n\t\t\t<div  class=\"dslc-modules-section  dslc-full \" style=\"padding-top:2px;padding-bottom:2px;padding-left:2%;padding-right:2%;background-color:#d7d6d7;\" data-section-id=\"d72503eead5\">\r\n\t\t\t\t\r\n\t\t\t\t\r\n\t\t\t\t<div class=\"dslc-modules-section-wrapper dslc-clearfix\"><div  class=\"dslc-modules-area dslc-col dslc-12-col dslc-last-col dslc-valign- \" data-size=\"12\" data-valign=\"\" data-modules-area-id=\"\" ><style type=\"text\/css\" id=\"dslca-modules-area-\"><\/style>\r\n\t\t<div id=\"dslc-module-4214a3386d8\" class=\"dslc-module-front dslc-module-DSLC_TP_Title dslc-in-viewport-check dslc-in-viewport-anim-none  dslc-col dslc-12-col dslc-last-col  dslc-module-handle-like-regular \" data-module-id=\"4214a3386d8\" data-module=\"DSLC_TP_Title\" data-dslc-module-size=\"12\" data-dslc-anim=\"none\" data-dslc-anim-delay=\"\" data-dslc-anim-duration=\"650\"  data-dslc-anim-easing=\"ease\" data-dslc-preset=\"none\" >\r\n\r\n\t\t\t\r\n\t\t\t\r\n\t\t\r\n\t<div class=\"dslc-tp-title\">\r\n\t\t\t\t\t<div class=\"dslc-tp-title\"><h1>Hybrid wafer-scale and die-level integration in microfluidics. Packaging and integration of micro\/nanostructures, sensors or other microdevices<\/h1><\/div>\r\n\t\t\t<\/div>\r\n\r\n\t\r\n\t\t\t\t<\/div><!-- .dslc-module -->\r\n\t\t\r\n\t\t<div id=\"dslc-module-0eabd8a7f1e\" class=\"dslc-module-front dslc-module-DSLC_TP_Content dslc-in-viewport-check dslc-in-viewport-anim-none  dslc-col dslc-10-col  dslc-module-handle-like-regular \" data-module-id=\"0eabd8a7f1e\" data-module=\"DSLC_TP_Content\" data-dslc-module-size=\"10\" data-dslc-anim=\"none\" data-dslc-anim-delay=\"\" data-dslc-anim-duration=\"650\"  data-dslc-anim-easing=\"ease\" data-dslc-preset=\"none\" >\r\n\r\n\t\t\t\r\n\t\t\t\r\n\t\t\t\t<div class=\"dslc-tp-content\">\r\n\t\t\t<p>After the successful microfluidic webinars on testing, failure mode and regulation aspects, we now announce our next webinar:<br \/>\nHybrid wafer-scale and die-level integration in microfluidics<br \/>\npackaging and integration of micro\/nanostructures, sensors or other microdevices<\/p>\n<p>Speakers:<br \/>\nMarko Blom, CTO <a href=\"https:\/\/www.micronit.com\/\" target=\"_blank\" rel=\"noopener\">Micronit<\/a><\/p>\n<p>Bernd Dielacher, Business Development Manager <a href=\"https:\/\/www.evgroup.com\/\" target=\"_blank\" rel=\"noopener\">EV Group<\/a><\/p>\n<p>Ruurd Boomsma, CTO <a href=\"https:\/\/www.besi.com\/\" target=\"_blank\" rel=\"noopener\">Besi<\/a><\/p>\n<p>Date: May 27, 2021<br \/>\nTime: 15.30 - 17.00 hrs<\/p>\n<p><a href=\"https:\/\/zoom.us\/webinar\/register\/WN_LCrHGO43Qiax5xc79mODkA\" target=\"_blank\" rel=\"noopener\">Register here<\/a>, after registering, you will receive a confirmation email containing information about joining the webinar.<\/p>\n<p>This webinar will be the first of two webinar series addressing hybrid manufacturing of microfluidics and particularly the assembly of microfluidic devices.<\/p>\n<p>Discussion afterwards will be led by Leanna Levine (<a href=\"https:\/\/alineinc.com\/\" target=\"_blank\" rel=\"noopener\">ALine, Inc<\/a>., MFA board member).<\/p>\n<p>After registration here you will receive a link to the meeting and a password.<\/p>\n<p>Future workshops\/meetings will be addressing further aspects of (hybrid) manufacturing, flow control and other based on suggestions and ideas from our members during our coming annual members meeting.<\/p>\n\t\t<\/div>\r\n\t\t\r\n\t\t\t\t<\/div><!-- .dslc-module -->\r\n\t\t\r\n\t\t<div id=\"dslc-module-a3f178382dd\" class=\"dslc-module-front dslc-module-DSLC_TP_Thumbnail dslc-in-viewport-check dslc-in-viewport-anim-none  dslc-col dslc-2-col dslc-last-col  dslc-module-handle-like-regular \" data-module-id=\"a3f178382dd\" data-module=\"DSLC_TP_Thumbnail\" data-dslc-module-size=\"2\" data-dslc-anim=\"none\" data-dslc-anim-delay=\"\" data-dslc-anim-duration=\"650\"  data-dslc-anim-easing=\"ease\" data-dslc-preset=\"none\" >\r\n\r\n\t\t\t\r\n\t\t\t\r\n\t\t\r\n\t\t\t<div class=\"dslc-tp-thumbnail\">\r\n\t\t\t\t\r\n\t\t\t\t\t\t\t\t\t<img width=\"317\" height=\"125\" src=\"https:\/\/enablingmnt.com\/wp-content\/uploads\/2021\/05\/27-mei-sprekers.png\" class=\"attachment-full size-full wp-post-image\" alt=\"\" title=\"27 mei sprekers\" srcset=\"https:\/\/enablingmnt.com\/wp-content\/uploads\/2021\/05\/27-mei-sprekers.png 317w, https:\/\/enablingmnt.com\/wp-content\/uploads\/2021\/05\/27-mei-sprekers-300x118.png 300w\" sizes=\"(max-width: 317px) 100vw, 317px\" \/>\t\t\t\t\r\n\t\t\t\t\t\t\t<\/div>\r\n\r\n\t\t\r\n\t\t\r\n\t\t\t\t<\/div><!-- .dslc-module -->\r\n\t\t<\/div><\/div><\/div><\/div><input type=\"hidden\" id=\"dslca-post-data-thumb\" value=\"https:\/\/enablingmnt.com\/wp-content\/uploads\/2021\/05\/27-mei-sprekers.png\" \/>","protected":false},"excerpt":{"rendered":"<p>Hybrid wafer-scale and die-level integration in microfluidics. Packaging and integration of micro\/nanostructures, sensors or other microdevices After the successful microfluidic webinars on testing, failure mode and regulation aspects, we now announce our next webinar: Hybrid wafer-scale and die-level integration in microfluidics packaging and integration of micro\/nanostructures, sensors or other microdevices Speakers: Marko Blom, CTO Micronit [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"iawp_total_views":2050,"footnotes":""},"class_list":["post-22","page","type-page","status-publish","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Home - enablingMNT<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/enablingmnt.com\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Home - enablingMNT\" \/>\n<meta property=\"og:description\" content=\"Hybrid wafer-scale and die-level integration in microfluidics. Packaging and integration of micro\/nanostructures, sensors or other microdevices After the successful microfluidic webinars on testing, failure mode and regulation aspects, we now announce our next webinar: Hybrid wafer-scale and die-level integration in microfluidics packaging and integration of micro\/nanostructures, sensors or other microdevices Speakers: Marko Blom, CTO Micronit [&hellip;]\" \/>\n<meta property=\"og:url\" content=\"https:\/\/enablingmnt.com\/\" \/>\n<meta property=\"og:site_name\" content=\"enablingMNT\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"19 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/enablingmnt.com\\\/\",\"url\":\"https:\\\/\\\/enablingmnt.com\\\/\",\"name\":\"Home - enablingMNT\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/enablingmnt.com\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/enablingmnt.com\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/enablingmnt.com\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/enablingmnt.com\\\/wp-content\\\/uploads\\\/2019\\\/11\\\/thumb_business_support-150x150-10-2.jpg\",\"datePublished\":\"2019-11-22T10:26:00+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/enablingmnt.com\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/enablingmnt.com\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/enablingmnt.com\\\/#primaryimage\",\"url\":\"https:\\\/\\\/enablingmnt.com\\\/wp-content\\\/uploads\\\/2019\\\/11\\\/thumb_business_support-150x150-10-2.jpg\",\"contentUrl\":\"https:\\\/\\\/enablingmnt.com\\\/wp-content\\\/uploads\\\/2019\\\/11\\\/thumb_business_support-150x150-10-2.jpg\",\"width\":150,\"height\":150},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/enablingmnt.com\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/enablingmnt.com\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Home\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/enablingmnt.com\\\/#website\",\"url\":\"https:\\\/\\\/enablingmnt.com\\\/\",\"name\":\"enablingMNT\",\"description\":\"Your provider of Business Development Support, Engineering Services, Marketing, and Training across the Micro and Nanosystems Technology sectors\",\"publisher\":{\"@id\":\"https:\\\/\\\/enablingmnt.com\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/enablingmnt.com\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/enablingmnt.com\\\/#organization\",\"name\":\"enablingMNT\",\"url\":\"https:\\\/\\\/enablingmnt.com\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/enablingmnt.com\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/enablingmnt.com\\\/wp-content\\\/uploads\\\/2019\\\/11\\\/cropped-cropped-cropped-cropped-PS_enablingMNT_logo_300-2.jpg\",\"contentUrl\":\"https:\\\/\\\/enablingmnt.com\\\/wp-content\\\/uploads\\\/2019\\\/11\\\/cropped-cropped-cropped-cropped-PS_enablingMNT_logo_300-2.jpg\",\"width\":300,\"height\":142,\"caption\":\"enablingMNT\"},\"image\":{\"@id\":\"https:\\\/\\\/enablingmnt.com\\\/#\\\/schema\\\/logo\\\/image\\\/\"}}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Home - enablingMNT","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/enablingmnt.com\/","og_locale":"en_US","og_type":"article","og_title":"Home - enablingMNT","og_description":"Hybrid wafer-scale and die-level integration in microfluidics. 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