{"id":243,"date":"2021-05-03T16:11:27","date_gmt":"2021-05-03T15:11:27","guid":{"rendered":"https:\/\/enablingmnt.com\/?p=243"},"modified":"2021-06-07T12:02:52","modified_gmt":"2021-06-07T11:02:52","slug":"hybrid-wafer-scale-and-die-level-integration-in-microfluidics-packaging-and-integration-of-micro-nanostructures-sensors-or-other-microdevices-webinar","status":"publish","type":"post","link":"https:\/\/enablingmnt.com\/?p=243","title":{"rendered":"Hybrid wafer-scale and die-level integration in microfluidics. Packaging and integration of micro\/nanostructures, sensors or other microdevices"},"content":{"rendered":"<div id=\"dslc-main\">\r\n\t\t\t<div  class=\"dslc-modules-section  dslc-full \" style=\"padding-top:2px;padding-bottom:2px;padding-left:2%;padding-right:2%;background-color:#d7d6d7;\" data-section-id=\"d72503eead5\">\r\n\t\t\t\t\r\n\t\t\t\t\r\n\t\t\t\t<div class=\"dslc-modules-section-wrapper dslc-clearfix\"><div  class=\"dslc-modules-area dslc-col dslc-12-col dslc-last-col dslc-valign- \" data-size=\"12\" data-valign=\"\" data-modules-area-id=\"\" ><style type=\"text\/css\" id=\"dslca-modules-area-\"><\/style>\r\n\t\t<div id=\"dslc-module-4214a3386d8\" class=\"dslc-module-front dslc-module-DSLC_TP_Title dslc-in-viewport-check dslc-in-viewport-anim-none  dslc-col dslc-12-col dslc-last-col  dslc-module-handle-like-regular \" data-module-id=\"4214a3386d8\" data-module=\"DSLC_TP_Title\" data-dslc-module-size=\"12\" data-dslc-anim=\"none\" data-dslc-anim-delay=\"\" data-dslc-anim-duration=\"650\"  data-dslc-anim-easing=\"ease\" data-dslc-preset=\"none\" >\r\n\r\n\t\t\t\r\n\t\t\t\r\n\t\t\r\n\t<div class=\"dslc-tp-title\">\r\n\t\t\t\t\t<div class=\"dslc-tp-title\"><h1>Hybrid wafer-scale and die-level integration in microfluidics. Packaging and integration of micro\/nanostructures, sensors or other microdevices<\/h1><\/div>\r\n\t\t\t<\/div>\r\n\r\n\t\r\n\t\t\t\t<\/div><!-- .dslc-module -->\r\n\t\t\r\n\t\t<div id=\"dslc-module-0eabd8a7f1e\" class=\"dslc-module-front dslc-module-DSLC_TP_Content dslc-in-viewport-check dslc-in-viewport-anim-none  dslc-col dslc-10-col  dslc-module-handle-like-regular \" data-module-id=\"0eabd8a7f1e\" data-module=\"DSLC_TP_Content\" data-dslc-module-size=\"10\" data-dslc-anim=\"none\" data-dslc-anim-delay=\"\" data-dslc-anim-duration=\"650\"  data-dslc-anim-easing=\"ease\" data-dslc-preset=\"none\" >\r\n\r\n\t\t\t\r\n\t\t\t\r\n\t\t\t\t<div class=\"dslc-tp-content\">\r\n\t\t\t<p>After the successful microfluidic webinars on testing, failure mode and regulation aspects, we now announce our next webinar:<br \/>\nHybrid wafer-scale and die-level integration in microfluidics<br \/>\npackaging and integration of micro\/nanostructures, sensors or other microdevices<\/p>\n<p>Speakers:<br \/>\nMarko Blom, CTO <a href=\"https:\/\/www.micronit.com\/\" target=\"_blank\" rel=\"noopener\">Micronit<\/a><\/p>\n<p>Bernd Dielacher, Business Development Manager <a href=\"https:\/\/www.evgroup.com\/\" target=\"_blank\" rel=\"noopener\">EV Group<\/a><\/p>\n<p>Ruurd Boomsma, CTO <a href=\"https:\/\/www.besi.com\/\" target=\"_blank\" rel=\"noopener\">Besi<\/a><\/p>\n<p>Date: May 27, 2021<br \/>\nTime: 15.30 - 17.00 hrs<\/p>\n<p><a href=\"https:\/\/zoom.us\/webinar\/register\/WN_LCrHGO43Qiax5xc79mODkA\" target=\"_blank\" rel=\"noopener\">Register here<\/a>, after registering, you will receive a confirmation email containing information about joining the webinar.<\/p>\n<p>This webinar will be the first of two webinar series addressing hybrid manufacturing of microfluidics and particularly the assembly of microfluidic devices.<\/p>\n<p>Discussion afterwards will be led by Leanna Levine (<a href=\"https:\/\/alineinc.com\/\" target=\"_blank\" rel=\"noopener\">ALine, Inc<\/a>., MFA board member).<\/p>\n<p>After registration here you will receive a link to the meeting and a password.<\/p>\n<p>Future workshops\/meetings will be addressing further aspects of (hybrid) manufacturing, flow control and other based on suggestions and ideas from our members during our coming annual members meeting.<\/p>\n\t\t<\/div>\r\n\t\t\r\n\t\t\t\t<\/div><!-- .dslc-module -->\r\n\t\t\r\n\t\t<div id=\"dslc-module-a3f178382dd\" class=\"dslc-module-front dslc-module-DSLC_TP_Thumbnail dslc-in-viewport-check dslc-in-viewport-anim-none  dslc-col dslc-2-col dslc-last-col  dslc-module-handle-like-regular \" data-module-id=\"a3f178382dd\" data-module=\"DSLC_TP_Thumbnail\" data-dslc-module-size=\"2\" data-dslc-anim=\"none\" data-dslc-anim-delay=\"\" data-dslc-anim-duration=\"650\"  data-dslc-anim-easing=\"ease\" data-dslc-preset=\"none\" >\r\n\r\n\t\t\t\r\n\t\t\t\r\n\t\t\r\n\t\t\t<div class=\"dslc-tp-thumbnail\">\r\n\t\t\t\t\r\n\t\t\t\t\t\t\t\t\t<img width=\"317\" height=\"125\" src=\"https:\/\/enablingmnt.com\/wp-content\/uploads\/2021\/05\/27-mei-sprekers.png\" class=\"attachment-full size-full wp-post-image\" alt=\"\" title=\"27 mei sprekers\" srcset=\"https:\/\/enablingmnt.com\/wp-content\/uploads\/2021\/05\/27-mei-sprekers.png 317w, https:\/\/enablingmnt.com\/wp-content\/uploads\/2021\/05\/27-mei-sprekers-300x118.png 300w\" sizes=\"(max-width: 317px) 100vw, 317px\" \/>\t\t\t\t\r\n\t\t\t\t\t\t\t<\/div>\r\n\r\n\t\t\r\n\t\t\r\n\t\t\t\t<\/div><!-- .dslc-module -->\r\n\t\t<\/div><\/div><\/div><\/div><input type=\"hidden\" id=\"dslca-post-data-thumb\" value=\"https:\/\/enablingmnt.com\/wp-content\/uploads\/2021\/05\/27-mei-sprekers.png\" \/>","protected":false},"excerpt":{"rendered":"<p>Hybrid wafer-scale and die-level integration in microfluidics. Packaging and integration of micro\/nanostructures, sensors or other microdevices After the successful microfluidic webinars on testing, failure mode and regulation aspects, we now announce our next webinar: Hybrid wafer-scale and die-level integration in microfluidics packaging and integration of micro\/nanostructures, sensors or other microdevices Speakers: Marko Blom, CTO Micronit [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":244,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_jetpack_newsletter_access":"","_jetpack_dont_email_post_to_subs":false,"_jetpack_newsletter_tier_id":0,"_jetpack_memberships_contains_paywalled_content":false,"iawp_total_views":36,"_jetpack_feature_clip_id":0,"_jetpack_memberships_contains_paid_content":false,"footnotes":"","jetpack_post_was_ever_published":false},"categories":[1],"tags":[],"class_list":["post-243","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.2 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Hybrid wafer-scale and die-level integration in microfluidics. 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Packaging and integration of micro\/nanostructures, sensors or other microdevices After the successful microfluidic webinars on testing, failure mode and regulation aspects, we now announce our next webinar: Hybrid wafer-scale and die-level integration in microfluidics packaging and integration of micro\/nanostructures, sensors or other microdevices Speakers: Marko Blom, CTO Micronit [&hellip;]\" \/>\n<meta property=\"og:url\" content=\"https:\/\/enablingmnt.com\/?p=243\" \/>\n<meta property=\"og:site_name\" content=\"enablingMNT\" \/>\n<meta property=\"article:published_time\" content=\"2021-05-03T15:11:27+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2021-06-07T11:02:52+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/enablingmnt.com\/wp-content\/uploads\/2021\/05\/27-mei-sprekers.png\" \/>\n\t<meta property=\"og:image:width\" content=\"317\" \/>\n\t<meta property=\"og:image:height\" content=\"125\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/png\" \/>\n<meta name=\"author\" content=\"admin\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"admin\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/enablingmnt.com\\\/?p=243#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/enablingmnt.com\\\/?p=243\"},\"author\":{\"name\":\"admin\",\"@id\":\"https:\\\/\\\/enablingmnt.com\\\/#\\\/schema\\\/person\\\/74f80df31bc15bc0096043be8ba7dda1\"},\"headline\":\"Hybrid wafer-scale and die-level integration in microfluidics. 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