After the successful microfluidic webinars on testing, failure mode and regulation aspects, we now announce our next webinar:
Hybrid wafer-scale and die-level integration in microfluidics
packaging and integration of micro/nanostructures, sensors or other microdevices
Marko Blom, CTO Micronit
Bernd Dielacher, Business Development Manager EV Group
Ruurd Boomsma, CTO Besi
Date: May 27, 2021
Time: 15.30 – 17.00 hrs
Register here, after registering, you will receive a confirmation email containing information about joining the webinar.
This webinar will be the first of two webinar series addressing hybrid manufacturing of microfluidics and particularly the assembly of microfluidic devices.
Discussion afterwards will be led by Leanna Levine (ALine, Inc., MFA board member).
After registration here you will receive a link to the meeting and a password.
Future workshops/meetings will be addressing further aspects of (hybrid) manufacturing, flow control and other based on suggestions and ideas from our members during our coming annual members meeting.